Push-Up Needles separate a diced Integrated Circuit Chip or an LED Device from Adhesive Film. The chip or device are picked up by a collet and carried to the next stage of the bonding process.
The smooth, highly polished taper and small angle of the needle’s tip allows for a gentle separation dice from the Adhesive Film. A long life span for the diamond push-up needles can be realized because of highly wear resistance of the material.
Specifications:
- Minimum Outer Diameter: φ0.4 mm
- Minimum Tip Radius: 10um